半导体封装 meaning in English

• semiconductor assembly

• "半导体" in English:    semiconductor
• "封装" in English:    package; potting; encapsulat ...
• "半导体封装测试业" in English:    ics assembly
• "晶体封装" in English:    crystal packaging
• "液体封装" in English:    liquid encapsulate
• "半导体集成电路封装术语" in English:    terminology of packages for semiconduc ...
• "带式载体封装" in English:    tctape carrier package
• "多媒体封装格式" in English:    multimedia container format
• "纯半导体，本征半导体" in English:    intrinsic semiconductor
• "塑料无引线芯片载体封装" in English:    carrier plastic leadless chip; carrier ...
• "塑料引线芯片载体封装" in English:    carrier, plastic leaded chi(plcc); pla ...
• "陶瓷式引线芯片载体封装" in English:    ceramic leaded chicarrier package (clc ...
• "无引线式芯片载体封装" in English:    leadless chicarrier (lcc)
• "有引脚片式载体封装" in English:    lcclead chicarrier package
• "alliance半导体" in English:    alliance semiconductor

• Semiconductor packaging equipment communication using winsock
  实现半导体封装设备的通信
• Wire bond parameter optimization in semiconductor assembly
  半导体封装超声波压焊的工艺参数优化
• Capacity planning in semiconductor assembly and test manufacturing system
  半导体封装测试系统的生产能力规划
• The study of wip control system in semiconductor assembly and test factory
  半导体封装测试厂库存控制系统的研究
• Assembly process and product reliability assurance system in samsung suzhou semiconductor
  苏州三星半导体封装工艺及产品可靠性保障体系
• Its main customers cover many famous semi - conductor assembly & test industrial componaies
  其主要客户包括世界著名的半导体封装及测试公司。
• To provide consultation and training to engineers / technicians on materials science / technology , and semiconductor packaging technology
  为工程师和技术员提供原材料技术和半导体封装技术支持和培训。
• Amkor technology ' s mission is to be the world ' s premier semiconductor assembly and test services company through customer satisfaction , leading edge technology and financial performance
  安靠的使命是通过客户的满意度、先进的技术和财务表现成为世界领先的半导体封装测试企业。
• A kind of particle swarm optimization method with the characteristic of logical time - sequenced is proposed and applied to procedure parameters optimization of semiconductor assembly product line
  摘要提出一种具有逻辑时序特征的微粒群优化算法，并将其应用于半导体封装生产线的工序参数优化中。
• It is suited for : high - tech electronic parts and related products such as magnetic head , ic , lsi , optical fiber , semiconductor , electronic lead frame and etc , require high precision disc wheel with high precision , efficiency cutting and break molding
  适用：高科技电子零件及相关产品，如磁头ic lsi光纤半导体封装品电子导线架等，要求高精度高效率切割切断加工的高精密薄片砂轮。