半导体封装 meaning in English
Translation
Mobile
- semiconductor assembly
- "半导体" in English: semiconductor
- "封装" in English: package; potting; encapsulat ...
- "半导体封装测试业" in English: ics assembly
- "晶体封装" in English: crystal packaging
- "液体封装" in English: liquid encapsulate
- "半导体集成电路封装术语" in English: terminology of packages for semiconduc ...
- "带式载体封装" in English: tctape carrier package
- "多媒体封装格式" in English: multimedia container format
- "纯半导体,本征半导体" in English: intrinsic semiconductor
- "塑料无引线芯片载体封装" in English: carrier plastic leadless chip; carrier ...
- "塑料引线芯片载体封装" in English: carrier, plastic leaded chi(plcc); pla ...
- "陶瓷式引线芯片载体封装" in English: ceramic leaded chicarrier package (clc ...
- "无引线式芯片载体封装" in English: leadless chicarrier (lcc)
- "有引脚片式载体封装" in English: lcclead chicarrier package
- "alliance半导体" in English: alliance semiconductor
Examples
- Semiconductor packaging equipment communication using winsock
实现半导体封装设备的通信 - Wire bond parameter optimization in semiconductor assembly
半导体封装超声波压焊的工艺参数优化 - Capacity planning in semiconductor assembly and test manufacturing system
半导体封装测试系统的生产能力规划 - The study of wip control system in semiconductor assembly and test factory
半导体封装测试厂库存控制系统的研究 - Assembly process and product reliability assurance system in samsung suzhou semiconductor
苏州三星半导体封装工艺及产品可靠性保障体系 - Its main customers cover many famous semi - conductor assembly & test industrial componaies
其主要客户包括世界著名的半导体封装及测试公司。 - To provide consultation and training to engineers / technicians on materials science / technology , and semiconductor packaging technology
为工程师和技术员提供原材料技术和半导体封装技术支持和培训。 - Amkor technology ' s mission is to be the world ' s premier semiconductor assembly and test services company through customer satisfaction , leading edge technology and financial performance
安靠的使命是通过客户的满意度、先进的技术和财务表现成为世界领先的半导体封装测试企业。 - A kind of particle swarm optimization method with the characteristic of logical time - sequenced is proposed and applied to procedure parameters optimization of semiconductor assembly product line
摘要提出一种具有逻辑时序特征的微粒群优化算法,并将其应用于半导体封装生产线的工序参数优化中。 - It is suited for : high - tech electronic parts and related products such as magnetic head , ic , lsi , optical fiber , semiconductor , electronic lead frame and etc , require high precision disc wheel with high precision , efficiency cutting and break molding
适用:高科技电子零件及相关产品,如磁头ic lsi光纤半导体封装品电子导线架等,要求高精度高效率切割切断加工的高精密薄片砂轮。
- More examples: 1 2
Related
"封装引出端子" in English, "单质半导体" in English, "半导体存储器" in English, "半导体物理实验室" in English, "半导体制造有限公司" in English, "光敏半导体材料" in English, "半导体二极管变阻器" in English, "半导体静态存储器" in English, "激活半导体材料" in English, "半导体分立器件外形尺寸" in English, "半导体分立器件文字符号" in English, "半导体分立器件型号命名方法" in English, "半导体分立器件制造" in English, "半导体分析师何浩铭" in English, "半导体封装测试业" in English, "半导体辐射热测量器" in English, "半导体辐射探测器" in English, "半导体辅助点火系" in English,